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Quality Policy

ISO9001 IATF

YJ ISO9001

IATF16949-J&V

IATF16949-YJ

J&V ISO9001

ISO14001

J&V ISO14001 （2026.7.1）

YJ ISO14001（2026.7.1）

QC080000

YJ QC080000 （2017）20241215

YJ QC080000 （2017）20241215

J&V QC080000 （2017）20241226

J&V QC080000 （2017）20241226

AEO认证企业证书

AEO certification

ANSI/ESD S20.20

YJ ANSI/ESD S20.20:2021

有卤素报告

RoHs package（Hongxin） A222015023810200101C 20220424 CN

RoHs package（Hongxin） A222015023810200101 20220424 EN

RoHs package（YJ）A2230133829102002C 20230403 CN

RoHs package（YJ）A2230133829102002 20230403 EN

无卤素报告

No RoHs package（Hongxin） A222015023810200201C 20220424 CN

No RoHs package（Hongxin） A222015023810200201 20220424 EN

No RoHs package（YJ）A2230133829102001C 20230403 CN

No RoHs package（YJ）A2230133829102001 20230403 EN

Module（YJ）A222015438710201C 20220429 REACH 223+2 CN

Discrete device（Sihong） phthalates A223013382910200301C CN

Discrete device（Sihong） phthalates A223013382910200301 EN

No RoHs package（Sihong）A223013382910200101C CN

No RoHs package（Sihong）A223013382910200101 EN

RoHs package（Sihong）A223013382910200201 EN

RoHs package（Sihong）A223013382910200201C CN

Chip Planar TVS (JV) A2230130009101002 ROHS HF 20230403 EN

Chip Planar TVS (JV) A2230130009101002C ROHS HF 20230403 CN

Chip (FRED-YJ) A2230162307101001C 20230418RoHS2.0 HF CN

Chip (FRED-YJ) A2230162307101001 20230418RoHS2.0 HF EN

Chip (PMBD-YJ) A2230162307101003 20230418RoHS2.0 HF EN

Chip (PMBD-YJ) A2230162307101003C 20230418RoHS2.0 HF EN

Chip (SKY-YJ) A2230162307101002 20230418RoHS2.0 HF EN

Chip (SKY-YJ) A2230162307101002C 20230418RoHS2.0 HF CN

SKY SVHC A2230162307102002

SKY SVHC A2230162307102002C

FRED SVHC A2230162307102001

PMBD SVHC A2230162307102003C

Diode & Bipolar transistor & Rectifier bridge SHAEC23000366225 20230213 RoHS2.0 EN

Planar TVS ROHS2.0 A2220176987101001C(CN)

Planar TVS ROHS2.0 A2220176987101001(EN)

Planar TVS SVHC A2230130009102002C(CN)

Planar TVS SVHC A2230130009102002(EN)

High voltage module AL SVHC A2230130009102001C (CN)

High voltage module AL SVHC A2230130009102001(EN)

High voltage module AL ROHS2.0 A2230130009101001C (CN)

High voltage module AL ROHS2.0 A2230130009101001(EN)

FRED SVHC A2230162307102001C

FRED SVHC A2230162307102001

FRED ROHS2.0+A2220165684101001C

FRED ROHS2.0+A2220165684101001

Bonded package (Hongxin）A222015023810400302C 20220426 REACH 223+2 CN

Bonded package (Hongxin）A222015023810400302 20220426 REACH 223+2 EN

Weld package (Hongxin) A223013382910102C REACH CN

Weld package (Hongxin) A223013382910102 REACH EN

Discrete device（Hongxin） phthalates A222015023810300101C 20220424 CN

Discrete device（Hongxin） phthalates A222015023810300101 20220424 EN

Patch（Sihong）SHAEC23000366228 20230222 RoHS CN

Patch（Sihong）SHAEC23000366227 20230222 RoHS EN

Bridge（Sihong）SHAEC23000366230 20230222 RoHS CN

Bridge（Sihong）SHAEC23000366230 20230222 RoHS EN

Power device SHAEC23000366210 20230203 RoHS2.0 CN

Power device SHAEC23000366220 20230206 RoHS2.0 EN

Diode & Bipolar transistor & Rectifier bridge SHAEC23000366225 20230213 RoHS2.0 CN

Discrete device（YJ） phthalates A2230133829102003C 20230403 CN

Discrete device（YJ） phthalates A2230133829102003 20230403 EN

Bonded package HAEC23001080406 20230222 ROHS2.0 CN

Bonded package SHAEC23001080405 20230222 ROHS2.0 EN

Weld package SHAEC23001080401 20230222 ROHS2.0 EN

Weld package SHAEC23001080402 20230222 ROHS2.0 CN

Module（YJ） A222015438710101C 20220429 RoHS2.0 CN

Module（YJ） A222015438710101 20220429 RoHS2.0 EN

Bonded package (YJ)A221018599610100101CR1 20230406 REACH CN

Weld package（YJ） A223013382910101C 20230406 REACH CN

Approach bridge SHAEC23000366203 20230206 RoHS2.0 EN

Approach bridge SHAEC23000366204 20230206 RoHS2.0 CN

Small signal (lead-free)SHAEC23000366208 20230203 RoHS2.0 CN

Small signal (lead-free) SHAEC23000366219 20230206 RoHS2.0 EN

Small signal (lead) SHAEC23000366206 20230203 RoHS2.0 CN

Small signal (lead) SHAEC23000366218 20230206 RoHS2.0 EN

Patch SHAEC23000366212 20230203 RoHS2.0 CN

Patch SHAEC23000366221 20230206 RoHS2.0 EN

Module（YJ） A222015438710101 20220429 RoHS2.0 EN

Module（YJ） A222015438710101C 20220429 RoHS2.0 CN

Frame bridge SHAEC23000366214 20230203 RoHS2.0 CN

Frame bridge SHAEC23000366222 20230206 RoHS2.0 EN

Diode SHAEC23000366216 20230203 RoHS2.0 CN

Diode SHAEC23000366223 20230206 RoHS2.0 EN

Glass tube SHAEC23000366202 20230203 RoHS2.0 CN

Glass tube SHAEC23000366217 20230206 RoHS2.0 EN

Weld package（YJ） A223013382910101 20230406 REACH EN

Module（YJ）A222015438710201 20220429 REACH 223+2 EN

Bonded package (YJ)A221018599610100101R1 20230406 REACH EN

Conflict free metal declaration

Investigation of cobalt and mica

Survey of cobalt

Tin, tantalum, tungsten, gold investigation

Code for the management of conflict minerals

模块

E230084-20220914-1-13-Package-MT

E230084-20130207- 2-1 Package-D1 D2

E230084-20130208- 2-2 Package-T1 T2

E230084-20130209- 2-3 Package-L1 L2

E230084-20130222- 2-4 Package-M2 M3 M5

E230084-20181017- 2-5 Package-M4

E230084-20190221- 2-6 Package-P1

插件桥堆

E230084-20230725 1-14-Package-3GBJ & JC

E230084-20200819- 3-1 Package MDS

E230084-20030321- 1-1 Package-KBU; Models-KBJ KBP GBJ GBP DF DB WOB DFS DBS MBS MBM

E230084-20060825- 1-2 Package-KBPC KBPCW GBPC GBPCW

E230084-20101019- 1-3 Package-D3K

E230084-20101020- 1-4 Package-GBU

E230084-20220826-1-5- Package-4KBJ

E230084-20101022- 1-6 Package-6KBJ

E230084-20101023- 1-7 Models-S25VB

E230084-20110610- 1-8 Models-KBP KBL

E230084-20141130- 1-9 Models-MT SKBPC SBR

E230084-20150429- 1-10 Models-GBJ GBL GBP DF 3GBJ

E230084-20161017- 1-11 Package-JA JB

E230084-20190813- 1-12 Package-PB

贴片桥堆

E313149-20160420- 1-1 Package-ABS DB DBL DBLS DBS MBS MBLS YBS YBSL

E313149-20190401- 1-2 Package-YBSM

IGBT

E230084-Vol5-Sec1-MG-E2A

TVS

E517074-Vol1-Sec1-20220307-SMAJ, P4SMA, SMA6J, SMBJ, P6SMB, 1.0SMB, SMB10J, 1.5SMC, SMCJ, SMC20J

E517074-Vol1-Sec1-SMB15J,SMB20J,SMDJ.5.0SMDJ

E516090-Vol1-Sec1-SMEJ76CA, SMEJ86CA, SMGJ80CA

CNAS